Performance Characteristics |
Extremely mild, for military and very clean electronic assembly surfaces. |
Mild for military and electronic assemblies |
General use in electronic and electrical assembly. |
Cosmetically clean appearance after soldering. Similar to RMA in terms of activity. |
Very active, residue easily removed. |
| Residue Removal |
Not required but solvent or saponifier soluble. |
Not required but solvent or saponifier soluble. |
Generally not required but solvent or saponifier soluble |
Not required but solvent or saponifier soluble. |
Residue must be removed. Neutralizer and warm water required |
| Use on these surfaces |
Platinum, Gold, Copper, Tin, Silver, Palladium, Solder |
Platinum, Gold, Copper, Tin, silver, Palladium, Solder |
Same as RMA plus; Nickel, Cadmium, Brass, Lead, Bronze, Beryllium Copper |
Platinum, Gold, Copper, Tin, Silver, Palladium, Solder |
Same as: R.A. plus: Kovar, Nickel-Iron |